Pressure-dependent conduction behavior of various particles for conductive adhesive applications

By Sancaktar Erol  

Journal of Adhesion Science and Technology, Vol. 13, Iss. 6, 1999-01 ,pp. : 679-693

Taylor & Francis Ltd

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Modeling of cohesive failure processes in structural adhesive bonded joints

By Du J.   Salmon F. T.   Pocius A. V.  

Journal of Adhesion Science and Technology, Vol. 18, Iss. 3, 2004-03 ,pp. : 287-299

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Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles

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Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1673-1697

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Modeling the rheology of anaerobic adhesive formulations

By Madrid M.   González-Gutiérrez L.   Martínez M.A.   Garriga A.  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 7, 2006-06 ,pp. : 677-691

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A 3D ductile constitutive mixed-mode model of cohesive elements for the finite element analysis of adhesive joints

By Anyfantis Konstantinos N.   Tsouvalis Nicholas G.  

Journal of Adhesion Science and Technology, Vol. 27, Iss. 10, 2013-05 ,pp. : 1146-1178

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