Effect of the physical and mechanical properties of epoxy resins on the adhesion behavior of epoxy/copper leadframe joints

Author: Cho Kilwon   Cho Eun Chul   Park Chan Eon  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.15, Iss.4, 2001-03, pp. : 439-456

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Abstract