Effect of the physical and mechanical properties of epoxy resins on the adhesion behavior of epoxy/copper leadframe joints

By Cho Kilwon   Cho Eun Chul   Park Chan Eon  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 4, 2001-03 ,pp. : 439-456

Taylor & Francis Ltd

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Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

By Cho J.H.  

Journal of Adhesion Science and Technology, Vol. 12, Iss. 5, 1998-01 ,pp. : 507-521

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Synergistic Toughening of Epoxy–Copper Interface Using a Thiol-Based Coupling Layer

By Wong Cell K. Y.  

Journal of Adhesion Science and Technology, Vol. 25, Iss. 16, 2011-08 ,pp. : 2081-2099

Taylor & Francis Ltd

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Adhesion of microfibrous surfaces on steel and copper to epoxy resins

By Hine P.J.   Muddarris S. El.   Packham D.E.  

Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. : 69-78

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Adhesion of electrolessly-deposited copper to photosensitive epoxy

By Ge J.   Tuominen R.   Kivilahti J. K.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 10, 2001-10 ,pp. : 1133-1143

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