Adhesion of underfill and components in flip chip encapsulation

By Fan Lianhua   Moon Kyoung-Sik   Wong C. P.  

Journal of Adhesion Science and Technology, Vol. 16, Iss. 2, 2002-02 ,pp. : 213-223

Taylor & Francis Ltd

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Adhesion between an underfill and the passivation layer in flip-chip packaging

By Luo Shijian   Wong C. P.  

Journal of Adhesion Science and Technology, Vol. 18, Iss. 2, 2004-02 ,pp. : 275-285

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Surface characteristics and adhesion performance of black oxide coated copper substrates with epoxy resins

By Lebbai Mohamed   Kim Jang-Kyo   Szeto W. K.  

Journal of Adhesion Science and Technology, Vol. 17, Iss. 11, 2003-11 ,pp. : 1543-1560

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Anisotropic Conductive Adhesives for Flip-Chip Interconnects

By Wang Weiqiang   Chan Y. C.   Pecht Michael  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 871-892

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Adhesion of microfibrous surfaces on steel and copper to epoxy resins

By Hine P.J.   Muddarris S. El.   Packham D.E.  

Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. : 69-78

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