Adhesion characteristics of underfill resins with flip chip package components

By Sham Man-Lung   Kim Jang-Kyo  

Journal of Adhesion Science and Technology, Vol. 17, Iss. 14, 2003-12 ,pp. : 1923-1944

Taylor & Francis Ltd

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Adhesion between an underfill and the passivation layer in flip-chip packaging

By Luo Shijian   Wong C. P.  

Journal of Adhesion Science and Technology, Vol. 18, Iss. 2, 2004-02 ,pp. : 275-285

Taylor & Francis Ltd

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Anisotropic Conductive Adhesives for Flip-Chip Interconnects

By Wang Weiqiang   Chan Y. C.   Pecht Michael  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 871-892

Taylor & Francis Ltd

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Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects

By Sinha K.   Farley D.   Kahnert T.   Solares S.D.   Dasgupta A.   Caers J.F.J.   Zhao X.J.  

Journal of Adhesion Science and Technology, Vol. 28, Iss. 12, 2014-06 ,pp. : 1167-1191

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Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

By Zhang Yan  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1717-1731

Taylor & Francis Ltd

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