Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching

By Paik Kyung W.   Ruoff Arthur L.  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 465-474

Taylor & Francis Ltd

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Adhesion enhancement of magnetron-sputtered copper films by ion bombardment etching treatment of nickel and Inconel substrates: investigations by Auger electron spectroscopy and secondary ion mass spectroscopy of the ion beam effects

By Cahoreau M.  

Journal of Adhesion Science and Technology, Vol. 5, Iss. 11, 1991-01 ,pp. : 987-999

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Adhesion and interface studies between copper and polyimide

By Kim Y.-H.   Walker G.F.   Kim J.   Park J.  

Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. : 331-339

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Adhesion strength of copper thin-films to a E24 carbon steel: effects of substrate surface ion bombardment etching

By Cailler M.  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 2, 1993-01 ,pp. : 141-157

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Adhesion Properties and Structure of Ion-Beam Modified Polyimide Films

By Kim Youn J.  

Journal of Adhesion Science and Technology, Vol. 25, Iss. 9, 2011-03 ,pp. : 993-1000

Taylor & Francis Ltd

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