Effects of substrate bias voltage on adhesion of DC magnetron-sputtered copper films on E24 carbon steel: investigations by Auger electron spectroscopy

By Ouis Abousoufiane   Cailler Michel  

Journal of Adhesion Science and Technology, Vol. 27, Iss. 21, 2013-11 ,pp. : 2367-2386

Taylor & Francis Ltd

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Adhesion studies of radio-frequency sputtered SiO2 films on Ti, stainless steel, Ni and Inconel substrates. Effects of substrate surface ion bombardment etching

By Lee G.H.  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 481-501

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Adhesion enhancement of polyimide on copper by Ar ion beam etching of copper

By Paik Kyung W.   Ruoff Arthur L.  

Journal of Adhesion Science and Technology, Vol. 2, Iss. 1, 1988-01 ,pp. : 245-253

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Adhesion strength of copper thin-films to a E24 carbon steel: effects of substrate surface ion bombardment etching

By Cailler M.  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 2, 1993-01 ,pp. : 141-157

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Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching

By Paik Kyung W.   Ruoff Arthur L.  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 465-474

Taylor & Francis Ltd

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