Anisotropic Conductive Adhesives for Flip-Chip Interconnects

By Wang Weiqiang   Chan Y. C.   Pecht Michael  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 871-892

Taylor & Francis Ltd

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Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

By Zhang Yan  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1717-1731

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Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste

By Noh Bo-In  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 13, 2008-09 ,pp. : 1355-1364

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Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films

By Kim Jong-Woong  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 13, 2008-09 ,pp. : 1339-1354

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Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy

By Lee Jong-Bum   Lee Jong-Gun   Ha Sang-Su   Jung Seung-Boo  

Journal of Adhesion Science and Technology, Vol. 25, Iss. 18, 2011-08 ,pp. : 2475-2482

Taylor & Francis Ltd

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