Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy

Author： Lee Jong-Bum   Lee Jong-Gun   Ha Sang-Su   Jung Seung-Boo  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.25, Iss.18, 2011-08, pp. : 2475-2482

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