Selective removal of 10–40-nm particles from silicon wafers using laser-induced plasma shockwaves

Author: Peri M. D. Murthy   Devarapalli Vamsi K.   Cetinkaya Cetin  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.21, Iss.3-4, 2007-04, pp. : 331-337

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Abstract