Adhesion of polyimides to ceramics: Effects of aminopropyltriethoxysilane and temperature and humidity exposure on adhesion

By Buchwalter L.P.  

Journal of Adhesion Science and Technology, Vol. 5, Iss. 4, 1991-01 ,pp. : 333-343

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Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an AC nitrogen glow discharge

By Ma J.B.  

Journal of Adhesion Science and Technology, Vol. 9, Iss. 4, 1995-01 ,pp. : 487-499

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Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage

By Wang Zenglin   Furuya Akihiko   Yasuda Keiichirou   Ikeda Hideo   Baba Tomoyuki   Hagiwara Muneaki   Toki Sotaro   Shingubara Shoso   Kubota Hiroshi   Ohmi Tadahiro  

Journal of Adhesion Science and Technology, Vol. 16, Iss. 8, 2002-07 ,pp. : 1027-1040

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Effect of the environment on the measured values of the adhesion of polyimide to silicon

By Paek Sang-Hyon  

Journal of Adhesion Science and Technology, Vol. 13, Iss. 4, 1999-01 ,pp. : 423-436

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Adhesion strength of plasma-assisted CVD B(C,N) film to silicon substrate

By Nakamura S.  

Journal of Adhesion Science and Technology, Vol. 13, Iss. 5, 1999-01 ,pp. : 615-627

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