Plasma surface modification of polyimide for improving adhesion to electroless copper coatings

By Rozovskis G.   Vinkevičius J.   Jačiauskiene J.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 5, 1996-01 ,pp. : 399-406

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Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide

By Inagaki N.   Tasaka S.   Ohmori H.   Mibu S.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 3, 1996-01 ,pp. : 243-256

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Temperature and humidity effects on adhesion of polyimide film to a silicon substrate

By Hu Dyi-Chung   Chen Hsi-Chieh  

Journal of Adhesion Science and Technology, Vol. 6, Iss. 5, 1992-01 ,pp. : 527-536

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Improved adhesion between plasma-treated polyimide film and evaporated copper

By Inagaki N.   Tasaka S.   Hibi K.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 4, 1994-01 ,pp. : 395-410

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Adhesion interaction between electrolessly deposited copper film and polyimide

By Vorobyova T.N.  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 2, 1997-01 ,pp. : 167-182

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