Observations and simple fracture mechanics analysis of indentation fracture delamination of TiN films on silicon

By Weppelmann E.R.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 6, 1994-01 ,pp. : 611-624

Taylor & Francis Ltd

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Effects of substrate bias voltage on adhesion of DC magnetron-sputtered copper films on E24 carbon steel: investigations by Auger electron spectroscopy

By Ouis Abousoufiane   Cailler Michel  

Journal of Adhesion Science and Technology, Vol. 27, Iss. 21, 2013-11 ,pp. : 2367-2386

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Assessment of adhesion of Ti(Y)N and Ti(La)N coatings by an in situ SEM constant-rate tensile test

By Zhiming Yu   Changqing Liu   Li Yu   Zhujing Jin  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 6, 1994-01 ,pp. : 679-685

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Adhesion enhancement of magnetron-sputtered copper films by ion bombardment etching treatment of nickel and Inconel substrates: investigations by Auger electron spectroscopy and secondary ion mass spectroscopy of the ion beam effects

By Cahoreau M.  

Journal of Adhesion Science and Technology, Vol. 5, Iss. 11, 1991-01 ,pp. : 987-999

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Adhesion and tribological properties of TiTaBN coatings with a graded interlayer deposited by pulsed DC biased and continuous dc biased magnetron sputtering

By Baran Özlem   Efeoğlu İhsan   Hardell Jens   Prakash Braham  

Journal of Adhesion Science and Technology, Vol. 29, Iss. 18, 2015-09 ,pp. : 2006-2019

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