Plasma surface modification of polyimide for improving adhesion to electroless copper coatings

By Rozovskis G.   Vinkevičius J.   Jačiauskiene J.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 5, 1996-01 ,pp. : 399-406

Taylor & Francis Ltd

Access to resources Recommend Favorite

Hydrophilic modification of a polyimide film surface

By Zhu Boru   Iwata Hiroo   Hirata Isao   Ikada Yoshito  

Journal of Adhesion Science and Technology, Vol. 14, Iss. 3, 2000-01 ,pp. : 351-361

Taylor & Francis Ltd

Access to resources Recommend Favorite

Tantalum and chromium adhesion to polyimide. Part 1. BPDA-PDA surface imidization and modification

By Buchwalter L.P.   Saraf R.  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 9, 1993-01 ,pp. : 925-940

Taylor & Francis Ltd

Access to resources Recommend Favorite

Surface modification of silica particles using polyimide

By Nishida Yoshikazu   Takahashi Hiroaki   Iso Mamoru   Matsuoka Masakuni   Partch Richard  

Advanced Powder Technology, Vol. 16, Iss. 2, 2005-04 ,pp. : 171-180

VSP

Access to resources Recommend Favorite

Surface modification of polymers and improvement of the adhesion between evaporated copper metal film and a polymer. I. Chemical modification of PET

By Kim Eun-Young   Kong Ju-Shik   An Seung-Kook   Kim Han-Do  

Journal of Adhesion Science and Technology, Vol. 14, Iss. 9, 2000-05 ,pp. : 1119-1130

Taylor & Francis Ltd

Access to resources Recommend Favorite