Effects of the surface modification by remote hydrogen plasma on adhesion in the electroless copper / tetrafluoroethylene - hexafluoropropylene copolymer (FEP) system

By Inagaki N.   Tasaka S.   Park Y.W.  

Journal of Adhesion Science and Technology, Vol. 12, Iss. 10, 1998-01 ,pp. : 1105-1119

Taylor & Francis Ltd

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Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage

By Wang Zenglin   Furuya Akihiko   Yasuda Keiichirou   Ikeda Hideo   Baba Tomoyuki   Hagiwara Muneaki   Toki Sotaro   Shingubara Shoso   Kubota Hiroshi   Ohmi Tadahiro  

Journal of Adhesion Science and Technology, Vol. 16, Iss. 8, 2002-07 ,pp. : 1027-1040

Taylor & Francis Ltd

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Modification of polyimide surface morphology: relationship between modification depth and adhesion strength

By Lee Kang-Wook  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 10, 1994-01 ,pp. : 1077-1092

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Oxygen plasma modification of polyimide webs: effect of ion bombardment on metal adhesion

By Egitto F.D.   Matienzo L.J.   Blackwell K.J.   Knoll A.R.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 4, 1994-01 ,pp. : 411-433

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Surface modification of polyimide film surface by silane coupling reactions for copper metallization

By Inagaki N.   Tasaka S.   Baba T.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 7, 2001-07 ,pp. : 749-762

Taylor & Francis Ltd

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