Plasma surface modification of polyimide for improving adhesion to electroless copper coatings

By Rozovskis G.   Vinkevičius J.   Jačiauskiene J.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 5, 1996-01 ,pp. : 399-406

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Surface modification of polymers and improvement of the adhesion between evaporated copper metal film and a polymer. I. Chemical modification of PET

By Kim Eun-Young   Kong Ju-Shik   An Seung-Kook   Kim Han-Do  

Journal of Adhesion Science and Technology, Vol. 14, Iss. 9, 2000-05 ,pp. : 1119-1130

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Effects of the surface modification by remote hydrogen plasma on adhesion in the electroless copper / tetrafluoroethylene - hexafluoropropylene copolymer (FEP) system

By Inagaki N.   Tasaka S.   Park Y.W.  

Journal of Adhesion Science and Technology, Vol. 12, Iss. 10, 1998-01 ,pp. : 1105-1119

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Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper

By Yang G. H.   Kang E. T.   Neoh K. G.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 6, 2001-06 ,pp. : 727-746

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Surface modification of poly(tetrafluoroethylene) films by graft copolymerization for adhesion enhancement with electrolessly deposited copper

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Journal of Adhesion Science and Technology, Vol. 14, Iss. 11, 2000-09 ,pp. : 1451-1468

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