18 μm electrodeposited copper foil for flex fatigue applications

By Merchant Harish D   Jr Melvin G Minor   Clouser Sid J   Leonard Dan T  

Circuit World, Vol. 25, Iss. 1, 1999-01 ,pp. : 38-46

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Costing a Printed Circuit Board

By O'Hara Brian  

Circuit World, Vol. 7, Iss. 3, 1993-12 ,pp. : 64-66

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Testing and long-term monitoring within printed circuit board cleaning technology

By Svetský Štefan  

Circuit World, Vol. 37, Iss. 2, 2011-05 ,pp. : 27-32

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

SAVIA, an advanced multi-layer parallel lamination technique for high density, high performance printed circuit boards

By Kim Taehoon   Mok Jee-Soo   Song Chang-Kyu   Park Jun-Heyoung   Kim Kyung-O   Sun Ben   Min Byung-Youl  

Circuit World, Vol. 31, Iss. 3, 2005-09 ,pp. : 17-20

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Catalytic anodes for electrodeposition: a study for acid copper printed circuit board (PCB) production

By Gabe D.R.   Cobley A.J.  

Circuit World, Vol. 32, Iss. 3, 2006-09 ,pp. : 3-10

Emerald Group Publishing Ltd

Access to resources Recommend Favorite