18 μm electrodeposited copper foil for flex fatigue applications

Author： Merchant Harish D Jr Melvin G Minor Clouser Sid J Leonard Dan T

ISSN： 0305-6120

Source： Circuit World, Vol.25, Iss.1, 1999-01, pp. : 38-46

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Drum Side Treated Foil: Advanced Copper Foil Technology for Multilayer Printed Circuit Board Applications

By Bergum E J

Circuit World, Vol. 22, Iss. 1, 1996-01 ,pp. : 10-13

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Metallurgy and performance of electrodeposited copper for flexible circuits

By Merchant H.D. Wang J.T. Giannuzzi L.A. Liu Y.L.

Circuit World, Vol. 26, Iss. 4, 2000-12 ,pp. : 7-14

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

New materials and build-up constructions for advanced rigid-flex PCB applications

By Rapala-Virtanen Tarja Jokela Timo

Circuit World, Vol. 31, Iss. 4, 2005-12 ,pp. : 21-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

High Strength, Low Profile Copper Foil for High Performance PCBs

By Chiang S.K. DiFranco D.F. Pucci D.G.

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 56-59

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

High-performance substrate from new epoxy resin and enhanced copper foil

By Valette Ludovic Wiechmann Rudolf

Circuit World, Vol. 30, Iss. 4, 2004-04 ,pp. : 20-26

Emerald Group Publishing Ltd

Access to resources Recommend Favorite