Flip Chip Rework Process

By Vasan S.V.   Truong P.T.   Dody G.  

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 16-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Development of Flip-chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder*

By Liu J   Boustedt K   Lai Z  

Circuit World, Vol. 22, Iss. 2, 1996-02 ,pp. : 19-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

A low-cost chip size package ‐ NuCSP

By Chou T.   Lau J.  

Circuit World, Vol. 24, Iss. 1, 1998-01 ,pp. : 34-38

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly

By Wun B.   Lau J.  

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 25-32

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

A novel flip-chip interconnection process for integrated circuits

By Sugden Mark W.   Hutt David A.   Whalley David C.   Liu Changqing  

Circuit World, Vol. 38, Iss. 4, 2012-11 ,pp. : 214-218

Emerald Group Publishing Ltd

Access to resources Recommend Favorite