A novel flip-chip interconnection process for integrated circuits

By Sugden Mark W.   Hutt David A.   Whalley David C.   Liu Changqing  

Circuit World, Vol. 38, Iss. 4, 2012-11 ,pp. : 214-218

Emerald Group Publishing Ltd

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Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly

By Wun B.   Lau J.  

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 25-32

Emerald Group Publishing Ltd

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X-ray Inspection of Flip Chip Attach Using Digital Tomosynthesis

By Rooks S.   Sack T.  

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 51-55

Emerald Group Publishing Ltd

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Low Cost Solder Bumped Flip Chip MCM-L Demonstration

By Kelly M.   Lau J.  

Circuit World, Vol. 21, Iss. 4, 1993-12 ,pp. : 14-17

Emerald Group Publishing Ltd

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High volume, low cost flip chip assembly on polyester flex

By Gilleo Ken   Boyes Bob   Corbett Steve   Larson Gary   Price Dave  

Circuit World, Vol. 25, Iss. 2, 1999-02 ,pp. : 11-17

Emerald Group Publishing Ltd

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