Optimizing BGA to PCB interconnections using multi-depth laser drilled blind vias-in-pad

ISSN： 0305-6120

Source： Circuit World, Vol.25, Iss.2, 1999-02, pp. : 31-34

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

The constraints of vias and layers and their impact on PCB design strategy

By Palmer P.J. Williams D.J.

Circuit World, Vol. 25, Iss. 4, 1999-04 ,pp. : 22-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Failure mechanism of solder bubbles in PCB vias during high-temperature assembly

By Chen Yuanming He Wei Zhou Guoyun Tao Zhihua Wang Yang Luo Daojun

Circuit World, Vol. 39, Iss. 3, 2013-08 ,pp. : 133-138

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

3D PCB architecture for next generation high speed interconnections

By Fjelstad Joseph Grundy Kevin Yasumura Gary

Circuit World, Vol. 31, Iss. 4, 2005-12 ,pp. : 25-33

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

PCB failure analysis related to the ENIG black pad problem

By Ramanauskas Rimantas Selskis Algirdas Juodkazyte Jurga Jasulaitiene Vitalija

Circuit World, Vol. 39, Iss. 3, 2013-08 ,pp. : 124-132

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

A novel copper electroplating formula for laser-drilled micro via and through hole filling

By Dow Wei-Ping Chen Hsiang-Hao

Circuit World, Vol. 30, Iss. 3, 2004-09 ,pp. : 33-36

Emerald Group Publishing Ltd

Access to resources Recommend Favorite