3D PCB architecture for next generation high speed interconnections

Author： Fjelstad Joseph Grundy Kevin Yasumura Gary

ISSN： 0305-6120

Source： Circuit World, Vol.31, Iss.4, 2005-12, pp. : 25-33

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Methods for achieving high speed acid copper electroplating in the PCB industry

By Cobley A.J. Gabe D.R.

Circuit World, Vol. 27, Iss. 3, 2001-09 ,pp. : 19-25

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Towards a PCB production floor metric for go/no go testing of lossy high speed transmission lines

By Gore Brandon Mellitz Richard Loyer Jeff Gaudion Martyn Burnikell Jean Carre Paul

Circuit World, Vol. 34, Iss. 4, 2008-11 ,pp. : 38-47

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Optimizing BGA to PCB interconnections using multi-depth laser drilled blind vias-in-pad

By Burgess Larry W Pauri Fabrizio

Circuit World, Vol. 25, Iss. 2, 1999-02 ,pp. : 31-34

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The Midwest ISO: The Next Generation

The Electricity Journal, Vol. 9, Iss. 3, 1996-04 ,pp. : 89-89

Elsevier

Access to resources Recommend Favorite

Design of an Architecture for Real-Time 3D PET Imaging

By Sciascio E.D. Manni A.R. Guzzardi R.

Real-Time Imaging, Vol. 4, Iss. 4, 1998-08 ,pp. : 255-262

Academic Press

Access to resources Recommend Favorite