A three-dimensional transmission line matrix (TLM) simulation method for thermal effects in high power insulated gate bipolar transistors

Author: Hocine R   Lim D   Pulko S.H.   Stambouli M.A. Boudghene   Saidane A  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.29, Iss.3, 2003-03, pp. : 27-32

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Abstract