Author： Nakagawa Toshiko
Publisher： Emerald Group Publishing Ltd
ISSN： 0305-6120
Source： Circuit World, Vol.29, Iss.3, 2003-03, pp. : 22-26
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
Surface coatings for fluxless soldering of copper
Circuit World, Vol. 29, Iss. 1, 2003-01 ,pp. :
Waste Treatment Process for Electroless Copper
By Holly J.D.
Circuit World, Vol. 17, Iss. 1, 1993-12 ,pp. :
Reliability comparison of different surface finishes on copper
By Yee Shelgon Ladhar Harjinder
Circuit World, Vol. 25, Iss. 1, 1999-01 ,pp. :
Treatment of Copper Surfaces in Printed Circuit Manufacture
Circuit World, Vol. 7, Iss. 2, 1993-12 ,pp. :