Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests

Author： Tuominen Aulis   Ristolainen Eero   Lehtinen Ville  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.11, Iss.1, 1999-01, pp. : 21-26

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