Period of time： 2015年1期
Publisher： Emerald Group Publishing Ltd
Founded in： 1981
Total resources： 58
ISSN： 0954-0911
Subject： TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 11,issue 1
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Evaluation of pre-deposited (no-flow) underfill for flip chip and CSP assembly
By Firmstone M.G.,Bartholomew P.M.,Lowrie D.J.J.,Mannan S.H.,Hutt D.A. in (1999)
Soldering & Surface Mount Technology,volume 11,issue 1 , Vol. 11, Iss. 1, 1999-01 , pp.
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Optimizing the reflow profile via defect mechanism analysis
Soldering & Surface Mount Technology,volume 11,issue 1 , Vol. 11, Iss. 1, 1999-01 , pp.Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests
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Soldering & Surface Mount Technology,volume 11,issue 1 , Vol. 11, Iss. 1, 1999-01 , pp.An evaluation of the effect of ageing on the cleanability of solder flux residues
By Zou L,Duˇsek M,Hunt C.P.,Dunn B.D. in (1999)
Soldering & Surface Mount Technology,volume 11,issue 1 , Vol. 11, Iss. 1, 1999-01 , pp.By Hunt Christopher,Zou Ling in (1999)
Soldering & Surface Mount Technology,volume 11,issue 1 , Vol. 11, Iss. 1, 1999-01 , pp.Solder joint reliability of plastic ball grid array packages
By Zhong Chong Hua,Yi Sung in (1999)
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