Fluxless Flip-chip Bonding on Flexible Substrates: A Comparison between Adhesive Bonding and Soldering*

Author: Aschenbrenner R   Zakel E   Azdasht** G   Kloeser A   H.Reichl  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.8, Iss.2, 1996-02, pp. : 5-11

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Abstract