Finite element analysis of flip?–?chip on board (FCOB) assembly during reflow soldering process

Author： Addagarla Annapurna   Prasad N. Siva  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.24, Iss.2, 2012-04, pp. : 92-99

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