Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

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Materials Science and Technology, Vol. 29, Iss. 4, 2013-04 ,pp. : 464-473

Maney Publishing

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Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

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Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

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Experiments on the aging of Sn–Ag–Cu solder alloys

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Phase diagram investigation and characterisation of ternary Sn In Me (Me = Ag, Cu) lead-free solder systems

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