Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

Author： Yoon J.-W.   Jung S.-B.  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.25, Iss.12, 2009-12, pp. : 1478-1484

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