Critical factors affecting paste flow during the stencil printing of solder paste

Author: Durairaj R   Nguty T.A.   Ekere N.N.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.13, Iss.2, 2001-04, pp. : 30-34

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract