Critical factors affecting paste flow during the stencil printing of solder paste

By Durairaj R   Nguty T.A.   Ekere N.N.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 2, 2001-04 ,pp. : 30-34

Emerald Group Publishing Ltd

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Correlation of solder paste rheology with computational simulations of the stencil printing process

By Durairaj R   Jackson G.J.   Ekere N.N.   Glinski G   Bailey C  

Soldering & Surface Mount Technology, Vol. 14, Iss. 1, 2002-01 ,pp. : 11-17

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Filling analyses of solder paste in the stencil printing process and its application to process design

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Soldering & Surface Mount Technology, Vol. 25, Iss. 3, 2013-06 ,pp. : 145-154

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A review of stencil printing for microelectronic packaging

By Kay Robert   Desmulliez Marc  

Soldering & Surface Mount Technology, Vol. 24, Iss. 1, 2012-02 ,pp. : 38-50

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Correlation between jamming and skipping during solder paste printing

By Hillman S.R.   Mannan S.H.   Durairaj R   Seman A   Ekere N.N.   Dusek M   Hunt C  

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