Process characterization of PCB assembly using 0201 packages with lead-free solder

By Geiger David   Mattsson Fredrik   Shangguan Dongkai   Ong MT   Wong Patrick   Wang Mei   Castello Todd   Yi Sammy  

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 22-27

Emerald Group Publishing Ltd

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Lead-free PCB assembly and effects of process conditions on the profile and reliability of solder joints

By Zhong Z.W.   Arulvanan P   Shi X.Q.  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 33-37

Emerald Group Publishing Ltd

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The effect of PCB surface finish on lead-free solder joints

By Nurmi Sami T   Sundelin Janne J   Ristolainen Eero O   Lepistö Toivo K  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 13-23

Emerald Group Publishing Ltd

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Effect of PCB surface finish on creep properties of lead-free solder joints

By Sundelin Janne J   Nurmi Sami T   Lepistö Toivo K   Ristolainen Eero O  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 3-9

Emerald Group Publishing Ltd

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Electrodeposition of lead-free solder alloys

By Goh Yingxin   Haseeb A.S.M.A.   Sabri Mohd Faizul Mohd  

Soldering & Surface Mount Technology, Vol. 25, Iss. 2, 2013-04 ,pp. : 76-90

Emerald Group Publishing Ltd

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