Effect of PCB surface finish on creep properties of lead-free solder joints

Author: Sundelin Janne J   Nurmi Sami T   Lepistö Toivo K   Ristolainen Eero O  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.17, Iss.4, 2005-04, pp. : 3-9

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Abstract