Microstructural investigation of lead-free BGAs soldered with tin-lead solder

Author： Grossmann Günter   Tharian Joy   Jud Pascal   Sennhauser Urs  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.17, Iss.2, 2005-06, pp. : 10-21

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Reliability of tin-lead balled BGAs soldered with lead-free solder paste

By Nurmi Sami Tapani   Ristolainen Eero Olavi  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 35-39

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Microstructural Analysis of Lead-Free Solder Alloys

By Kumar Vineet   Fang Zhigang Zak   Liang Jin   Dariavach Nader  

Metallurgical and Materials Transactions A, Vol. 37, Iss. 8, 2006-08 ,pp. : 2505-2514

Springer Publishing Company

Access to resources Recommend Favorite

Tin pest in Sn-0.5 wt.% Cu lead-free solder

By Kariya Yoshiharu   Williams Naomi   Gagg Colin   Plumbridge William  

JOM, Vol. 53, Iss. 6, 2001-06 ,pp. : 39-41

Springer Publishing Company

Access to resources Recommend Favorite

Electrodeposition of lead-free solder alloys

By Goh Yingxin   Haseeb A.S.M.A.   Sabri Mohd Faizul Mohd  

Soldering & Surface Mount Technology, Vol. 25, Iss. 2, 2013-04 ,pp. : 76-90

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Experimental investigation on the failure of lead-free solder joints under drop impact

By Liu Fang   Meng Guang   Zhao Mei  

Soldering & Surface Mount Technology, Vol. 22, Iss. 3, 2010-01 ,pp. : 36-41

Emerald Group Publishing Ltd

Access to resources Recommend Favorite