Tin pest in Sn-0.5 wt.% Cu lead-free solder

Author: Kariya Yoshiharu   Williams Naomi   Gagg Colin   Plumbridge William  

Publisher: Springer Publishing Company

ISSN: 1543-1851

Source: JOM, Vol.53, Iss.6, 2001-06, pp. : 39-41

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract