A systematic procedure for the selection of a lead-free solder paste in an electronics manufacturing environment

Author： Wable Girish S. Chu Quyen Damodaran Purushothaman Srihari Krishnaswami

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.17, Iss.2, 2005-06, pp. : 32-39

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