The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields

Author： Cheng Cong-qian   Zhao Jie   Xu Yang   Xu Fu-Min   Huang Ming-liang  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.21, Iss.2, 2009-04, pp. : 14-18

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Solid-liquid reactions: The effect of Cu content on Sn-Ag-Cu interconnects

By Lu Henry   Balkan Haluk   Simon K.  

JOM, Vol. 57, Iss. 6, 2005-06 ,pp. : 30-35

Springer Publishing Company

Access to resources Recommend Favorite

Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

By Kim Tae   Kim Young-Ho  

JOM, Vol. 56, Iss. 6, 2004-06 ,pp. : 45-49

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial reactions in molten Sn/Cu and molten In/Cu couples

By Su Lee-Ho   Yen Yee-Wen   Lin Chao-Ching   Chen Sinn-Wen  

Metallurgical and Materials Transactions B, Vol. 28, Iss. 5, 1997-10 ,pp. : 927-934

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial Reactions Between Liquid Sn-8Zn-3Bi Solders and Cu Substrates

By Lin W. H.   Chuang T. H.  

Journal of Materials Engineering and Performance, Vol. 12, Iss. 4, 2003-08 ,pp. : 452-455

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder joints

By Bi Wenzhen   Ju Guokui   Lin Fei   Xie Shifang   Wei Xicheng  

Soldering & Surface Mount Technology, Vol. 24, Iss. 4, 2012-09 ,pp. : 249-256

Emerald Group Publishing Ltd

Access to resources Recommend Favorite