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Soldering & Surface Mount Technology, Vol. 21, Iss. 2, 2009-04 ,pp. : 19-23

Emerald Group Publishing Ltd

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Reactions between Sn–Ag–Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

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Interfacial reactions in molten Sn/Cu and molten In/Cu couples

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Communication: Formation of Intermetallic Compounds in SnPbAg, SnAg, and SnAgCu Solders on Ni/Au Metallization

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Investigation of the effect of indium addition on wettability of Sn-Ag-Cu solders

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