Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

Author： Zou C.D.   Gao Y.L.   Yang B.   Zhai Q.J.   Andersson C.   Liu J.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.21, Iss.2, 2009-04, pp. : 9-13

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