The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging

By Kim Keun-Soo   Suganuma Katsuaki   Hwang Chi-Won   Kim Jong-Min  

JOM, Vol. 56, Iss. 6, 2004-06 ,pp. : 39-43

Springer Publishing Company

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Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

By Arra Minna   Shangguan Dongkai   Ristolainen Eero   Lepistö Toivo  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 18-25

Emerald Group Publishing Ltd

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Reflow profile study of the Sn-Ag-Cu solder

By Salam B   Virseda C   Da H   Ekere N.N.   Durairaj R  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 27-34

Emerald Group Publishing Ltd

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Experiments on the aging of Sn–Ag–Cu solder alloys

By Snugovsky L.   Perovic D. D.   Rutter J. W.  

Powder Metallurgy, Vol. 48, Iss. 2, 2005-06 ,pp. : 193-198

Maney Publishing

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Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M.   Punch J.   Collins M.   Ryan C.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

Emerald Group Publishing Ltd

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