Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Author: Arra Minna   Shangguan Dongkai   Ristolainen Eero   Lepistö Toivo  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.14, Iss.2, 2002-07, pp. : 18-25

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract