Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders

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Soldering & Surface Mount Technology, Vol. 24, Iss. 1, 2012-02 ,pp. : 4-11

Emerald Group Publishing Ltd

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The effect of PCB surface finish on lead-free solder joints

By Nurmi Sami T   Sundelin Janne J   Ristolainen Eero O   Lepistö Toivo K  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 13-23

Emerald Group Publishing Ltd

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Effect of PCB surface finish on creep properties of lead-free solder joints

By Sundelin Janne J   Nurmi Sami T   Lepistö Toivo K   Ristolainen Eero O  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 3-9

Emerald Group Publishing Ltd

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Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper

By Bukat K.   Koscielski M.   Sitek J.   Jakubowska M.   Mlozniak A.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 3, 2011-06 ,pp. : 150-160

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Time Depend Wettability Deterioration of Plasma Treated Polymeric Macro-Fibers

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Key Engineering Materials, Vol. 2017, Iss. 731, 2017-04 ,pp. : 43-48

Trans Tech Publications

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