Process characterization and reliability for the assembly of 01005 chip components

Author： Lee Yong-Won Kim Keun-Soo Suganuma Katsuaki

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.23, Iss.4, 2011-09, pp. : 235-243

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Process and pad design optimization for 01005 passive component surface mount assembly

By Wang Yu Olorunyomi Michael Dahlberg Martin Djurovic Zoran Anderson Johan Liu Johan

Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. : 34-44

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Optimization of lead free solder 01005 component assembly

By Liu Yueli Johnson R. Wayne

Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. : 15-27

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Finite element analysis of flip?–?chip on board (FCOB) assembly during reflow soldering process

By Addagarla Annapurna Prasad N. Siva

Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 92-99

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Process characterization of PCB assembly using 0201 packages with lead-free solder

By Geiger David Mattsson Fredrik Shangguan Dongkai Ong MT Wong Patrick Wang Mei Castello Todd Yi Sammy

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 22-27

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Lead-free PCB assembly and effects of process conditions on the profile and reliability of solder joints

By Zhong Z.W. Arulvanan P Shi X.Q.

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 33-37

Emerald Group Publishing Ltd

Access to resources Recommend Favorite