Three-dimensional thermal investigations at board level in a reflow oven using thermal-coupling method

Author： Lau Chun-Sean   Abdullah M.Z.   Ani F. Che  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.24, Iss.3, 2012-06, pp. : 167-182

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