Enhanced solder wettability of oxidized-copper with lead-free solder via Ar-H2 plasmas for flip-chip bumping: the effects of H2 flow rates

Author： Lin Y.S. Lin W.J. Chiu L.Y.

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.24, Iss.3, 2012-06, pp. : 183-190

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