Thermosonic flip-chip bonding for SAW filter

By Tomioka T.   Iguchi T.   Mori I.  

Microelectronics Reliability, Vol. 44, Iss. 1, 2004-01 ,pp. : 149-154

Elsevier

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Assembly and Reliability of Very Large Flip-chip on CQFP*

By Clementi J J   Dearing** G 0   Bergeron*** C  

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Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology--double-sided CSP and single-sided CSP

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Effects of chip scale package and flip-chip on the design and manufacturing of electronic products

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Microelectronics International, Vol. 15, Iss. 1, 1998-01 ,pp. : 35-38

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A simple modification of a flip-chip bonder to allow large area chip attach

By Fuchs S   Rindelhardt K   Barrett J   Stam F  

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