Benefits of Thermoplastic Conductive Adhesive in Advanced Electronics Packaging Applications*

Author: Firmstone M G   Bartholomew P M   Paterson G   Dietz** R   Robinson** P  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.14, Iss.2, 1997-02, pp. : 16-21

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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Abstract