Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array packages - NuCSP

ISSN： 1356-5362

Source： Microelectronics International, Vol.16, Iss.2, 1999-02, pp. : 24-33

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Thermal performance of a low-cost thermal enhanced plastic ball grid array package - NuBGA

By Lau John H Chen K.L. Wu F

Microelectronics International, Vol. 15, Iss. 2, 1998-02 ,pp. : 25-33

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Plastic Ball Grid Array Attachment: Assembly and Reliability Performance*

By Anderson L Primavera** A A

Microelectronics International, Vol. 14, Iss. 2, 1997-02 ,pp. : 11-15

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

By Kar Yap Boon Talik Noor Azrina Sauli Zaliman Fei Jean Siow Retnasamy Vithyacharan

Microelectronics International, Vol. 30, Iss. 1, 2013-01 ,pp. : 14-18

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

By Lee Tae-Kyu

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1967-1976

Springer Publishing Company

Access to resources Recommend Favorite

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

By Lee Tae-Kyu

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2564-2573

Springer Publishing Company

Access to resources Recommend Favorite