Cure behavior of a no flow underfill encapsulant

Author: Hsu D.T.   Kim H.K.   Shi F.G.   Tong H.Y.   Chungpaiboonpatana S   Davidson C   Adams J.M.  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.17, Iss.1, 2000-01, pp. : 22-27

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Abstract